RF-10 High Frequency PCB with Immersion Tin Finish

1.Introduction of RF-10

RF-10 copper clad laminates are composites of ceramic filled PTFE and woven fiberglass. RF-10 offers the advantage of high dielectric constant and low dissipation factor. The thin woven fiberglass reinforcement provides both low dielectric loss and improved rigidity for better handling and dimensional stability in multilayer circuits.

Engineered as a cost-effective substrate, RF-10 meets the industry's need for size reduction in RF applications. It bonds well with smooth low profile copper, and its low dissipation characteristics combined with smooth copper foil minimize insertion losses at higher frequencies where skin effect is significant.

2.Features:

Dielectric Constant: 10.2 ±0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
Thermal Conductivity: 0.85 W/mk (Unclad)
CTE: x=16 ppm/°C, y=20 ppm/°C, z=25 ppm/°C
Moisture Absorption: 0.08%
Flammability Rating: V-0

3.PCB Construction Details

4.PCB Stackup

Top Layer: 35μm copper
Core: 1.524mm (60mil) RF-10
Bottom Layer: 35μm copper

5.Board Statistics

Components: 26
Total Pads: 75 (43 thru-hole, 32 SMT)
Vias: 53
Nets: 2

6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Via Types: Through-hole only (no blind vias)
Availability: Worldwide shipping

7.Benefits

High DK enables RF circuit size reduction
Excellent dimensional stability
Tight DK tolerance (10.2 ±0.3)
Enhanced thermal management
Excellent copper adhesion
Low thermal expansion
Cost-effective performance

8.Target Applications

Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter wave applications
Radar and guidance systems
Point-to-point digital radio antennas
High-frequency communication systems